| 摘要 |
<p>PURPOSE: A multichip light emitting diode package is provided to implement white light with various color temperatures and the light with various colors and improve a radiation property of a light emitting diode package using ceramic, metal, metal alloy, or a substrate made of a semiconductor material with high thermal conductivity. CONSTITUTION: A substrate(10) has bonding pads which are electrically insulated. A separator(20) is attached on the substrate and includes a plurality of cavities. A light emitting diode chip(41,43) is mounted on the substrate corresponding to each cavity. A molding unit(51,53) covers the light emitting diode chips inside the cavity. A fluorescent material is positioned on one of cavities or inside the cavity.</p> |
