SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS

摘要

The present invention provides a method and an apparatus for processing a substrate which can process a main surface of a substrate using a heater without damage to the main surface of the substrate. The method for processing a substrate comprises: a process fluid supply step of supplying a process fluid to a main surface of a substrate; a substrate rotation step of rotating the substrate while maintaining a fluid film of the process fluid on the main surface of the substrate; a heater heating step of heating the fluid film of the process fluid using a heater facing the main surface of the substrate in parallel with the substrate rotation step; and a calorie adjustment step of adjusting calories per unit time which a certain part of the fluid film obtains from the heater according to the rotation speed of the substrate in parallel with the heater heating step.