| 发明名称 | Thermal management of an electronic device | ||
| 摘要 | A system for thermal energy storage is disclosed herein. The system includes an electronic device and a docking station to receive the electronic device. The electronic device contains a device thermal-energy storage material to absorb thermal energy from the electronic device. The electronic device is to thermally couple to the docking station. The docking station contains a dock thermal-energy storage material. The state transition temperature of the dock thermal-energy storage material is lower than the state transition temperature of the device thermal-energy storage material such that thermal energy is transferred from the device thermal-energy storage material to the dock thermal-energy storage material. | ||
| 申请公布号 | US8982560(B2) | 申请公布日期 | 2015.03.17 |
| 申请号 | US201213730241 | 申请日期 | 2012.12.28 |
| 申请人 | Intel Corporation | 发明人 | MacDonald Mark |
| 分类号 | H05K7/20;H05K13/00;G06F1/20 | 主分类号 | H05K7/20 |
| 代理机构 | International IP Law Group, P.L.L.C. | 代理人 | International IP Law Group, P.L.L.C. |
| 主权项 | 1. An electronic device, comprising a device thermal-energy storage material to absorb thermal energy from the electronic device; and a device thermal port thermally coupled to the device thermal-energy storage material, the device thermal port to couple to a docking station; wherein, when coupled to the docking station, thermal energy is transferred from the device thermal-energy storage material to a dock thermal-energy storage material in the docking station, the state transition temperature of the dock thermal-energy storage material being lower than the state transition temperature of the device thermal-energy storage material. | ||
| 地址 | Santa Clara CA US | ||