发明名称 Lamp having outer shell to radiate heat of light source
摘要 According to one or more arrangements, a lighting device such as a lamp may include a substrate on which one or more lighting elements are mounted. One or more aspects of the lamp may further provide heat conductive/dissipating properties. Additionally or alternatively, the substrate may include a through hole through which at least one wire of the lighting device may extend. For example, the wire may extend through the at least one through-hole from a first side of the substrate to a second side of the substrate. The wire may be connected to a pattern layer of the substrate. According to other aspects, the lighting device may further include a supporting body for supporting the substrate. The supporting body may include another through-hole through which the at least one wire further extends.
申请公布号 US8979315(B2) 申请公布日期 2015.03.17
申请号 US201213566572 申请日期 2012.08.03
申请人 Toshiba Lighting & Technology Corporation 发明人 Osawa Shigeru;Morikawa Kazuto
分类号 F21V29/00;F21V3/00;F21K99/00;F21V15/01;H05B33/08;F21V17/10;F21Y101/02;F21V23/00 主分类号 F21V29/00
代理机构 Banner & Witcoff, Ltd. 代理人 Banner & Witcoff, Ltd.
主权项 1. A lighting apparatus comprising: a substrate on which one or more lighting elements are mounted, the substrate including at least one through-hole; at least one wire extending through the at least one through-hole from a first side of the substrate to a second side of the substrate, wherein one end of the at least one wire is connected to a pattern layer of the substrate; a conductive supporting body having a support surface on which the substrate is supported and including at least one other through-hole through which the at least one wire extends; and an insulating member provided in the at least one other through-hole of the conductive supporting body, the insulating member having an insertion hole through which the at least one wire passes without contacting the conductive supporting body, wherein the at least one other through-hole of the conductive supporting body comprises a first hole part and a second hole part larger than the first hole part, the second hole part provided closer to the substrate than the first hole part, wherein the insulating member comprises a first part located in the first hole part and a second part located in the second hole part, the second part being larger than the first part, and wherein the insulating member is held between the substrate and a step positioned between the first hole part and the second hole part of the at least one other through-hole of the conductive supporting body.
地址 Yokosuka-shi, Kanagawa-ken JP
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