发明名称 |
Method and structure of sensors and MEMS devices using vertical mounting with interconnections |
摘要 |
A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon. The resulting device can then be singulated within a vicinity of the contact region(s) to form one or more singulated dies, each having a singulated surface region. The singulated die(s) can be coupled to a substrate member, having a first surface region, such that the singulated surface region(s) of the singulated die(s) are coupled to a portion of the first surface region. Interconnections can be formed between the die(s) and the substrate member with conductive adhesives, solder processes, or other conductive bonding processes. |
申请公布号 |
US8981560(B2) |
申请公布日期 |
2015.03.17 |
申请号 |
US201313923011 |
申请日期 |
2013.06.20 |
申请人 |
mCube Inc. |
发明人 |
Jensen Dave Paul;Wan Hong;Ewanich Jon |
分类号 |
H01L23/48;H01L23/52;H01L29/40;H01L23/00;B81B3/00 |
主分类号 |
H01L23/48 |
代理机构 |
Kilpatrick Townsend & Stockton LLP |
代理人 |
Kilpatrick Townsend & Stockton LLP |
主权项 |
1. An integrated sensor device or electronic device, the device comprising:
a substrate member having a first surface region, the substrate member having at least one contact region; at least one singulated integrated sensor or electronic device each coupled to a die member, each die member having a singulated surface region and at least one contact region, the singulated surface region(s) being coupled to the first surface region; at least one first conductive material formed overlying at least the contact region(s) of the singulated integrated sensor or electronic device; and at least one second conductive material formed overlying at least a portion of the first conductive material(s). |
地址 |
San Jose CA US |