Semiconductor package and method of forming the same

摘要

Semiconductor packages are disclosed. In a semiconductor package, a package board may include a hole. A mold layer may cover an upper portion of the package board and extend through the hole to cover at least a portion of a bottom surface of the package board. Each of the sidewalls of a lower mold portion may have a symmetrical structure with respect to the hole penetrating the package board, such that a warpage phenomenon of the semiconductor package may be reduced.

主权项

1. A semiconductor package comprising:
a package board including at least one hole; at least one semiconductor chip mounted on the package board by a flip chip bonding method; a mold layer having an upper mold portion covering the at least one semiconductor chip and the package board and a lower mold portion connected to the upper mold portion through the hole, the lower mold portion covering at least a portion of a bottom surface of the package board; lower solder balls disposed on the bottom surface of the package board, wherein the lower solder balls are not covered by the lower mold portion, and wherein a plurality of outermost sidewalls of the lower mold portion are disposed at a substantially equal distance from a center of the hole; and wherein the lower mold portion comprises:
a center pattern overlapped by the hole;at least one edge pattern spaced apart from the center pattern with at least one of the lower solder balls disposed therebetween; anda plurality of connection patterns connecting the center pattern to the edge pattern, wherein each of said connection patterns is disposed between adjacent ones of the lower solder balls.