| 摘要 |
<p>PROBLEM TO BE SOLVED: To allow semiconductor chip appearance inspection from a rear surface direction of a chip tray in a state where a semiconductor chip is being housed, for evaluating breaking and chipping on a rear surface of the semiconductor chip that is housed while suppressing mixing with noise at the appearance inspection using an image recognition device, relating to the chip tray of a semiconductor chip.SOLUTION: The entire chip tray is made from an opaque member, including a chip pocket part. The chip pocket part is provided with an opening part having a dimension capable of observing two sides facing each other of a square semiconductor chip from a bottom surface side at the same time when the semiconductor chip is housed. The opening part is made from a transparent member, formed in mesh or with a stripe-like through hole. The opening part is provided at a central part in a length direction of the semiconductor chip, so that the appearance inspection of a point which is most affected by cracking of a chip and chipping is performed from a rear surface while being housed.</p> |
