发明名称 CUTTING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a cutting device capable of preventing a cutting chip generated during cutting from adhering to a surface of a workpiece.SOLUTION: A cutting device comprises: workpiece holding means for holding a workpiece; cutting means with a cutting blade for cutting the workpiece held on the workpiece holding means; cutting water supply means with a cutting water supply nozzle for supplying cutting water to a cutting part cut by the cutting blade; cutting feed means for relatively moving the workpiece holding means and the cutting means in a cutting feed direction; and indexing feed means for relatively moving the workpiece holding means and the cutting means in an indexing feed direction orthogonal to the cutting feed direction. The cutting device further includes ultraviolet light irradiation means, disposed adjacent to the cutting water supply nozzle, for irradiating with ultraviolet light an upper surface of the workpiece held on the workpiece holding means.</p>
申请公布号 JP2015050406(A) 申请公布日期 2015.03.16
申请号 JP20130182814 申请日期 2013.09.04
申请人 DISCO ABRASIVE SYST LTD 发明人 SEKIYA KAZUMA
分类号 H01L21/301;H01L21/304 主分类号 H01L21/301
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