发光二极体的封装方法及其结构;PACKAGING METHOD OF LIGHT EMITTING DIODE AND STRUCTURE THEREOF

摘要

一种发光二极体封装方法，包括以下步骤：提供一电极架，所述电极架包含至少一个电极组，每个电极组包含一个第一电极和一个第二电极，所述第一电极和第二电极间隔设置；提供一模具，该模具包含上模和下模，上模设有至少一个凸出部，下模设有容置槽；在容置槽中注入液态高分子材料，并将电极架浸泡于容置槽中的液态高分子材料中；压合上模、下模使凸出部与电极架接触，固化液态高分子材料，并脱上、下模，以获得发光二极体的反射杯及基板；在反射杯内设置发光二极体晶片，并使发光二极体晶片与电极架电连接；在反射杯中填充封装材料。; providing a first mould and a second mould, the first mould including at least a convex platform, and the second mould including a groove; injecting polymer solution into the groove of the second mould, and immersing the electrode frame into the polymer solution; forcing the convex platform to contact the electrode frame by pressing the first and the second mould, solidifying the polymer solution and removing the first and the second mould to form a reflection cup and a substrate; arranging a light emitting diode in the reflection cup, and electrically connecting the light emitting diode with the electrode frame; and filling packaging materials into the reflection cup.