发明名称 |
METHOD FOR PRODUCING SiC EPITAXIAL WAFER |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing an SiC epitaxial wafer, capable of producing high quality SiC epitaxial wafers with a high production efficiency.SOLUTION: A method for producing an SiC epitaxial wafer of the present invention includes the steps of: vacuum baking a coated carbon material member at a vacuum degree of 2.0×10Pa or less in a vacuum baking furnace for exclusive use; placing the coated carbon material member in an epitaxial wafer production apparatus; and disposing an SiC substrate in the epitaxial wafer production apparatus and epitaxially growing an SiC epitaxial film on the SiC substrate. |
申请公布号 |
JP2015050436(A) |
申请公布日期 |
2015.03.16 |
申请号 |
JP20130183373 |
申请日期 |
2013.09.04 |
申请人 |
SHOWA DENKO KK |
发明人 |
ODAWARA MICHIYA;TAJIMA YUTAKA;MUTO DAISUKE;MOMOSE KENJI |
分类号 |
H01L21/205;C23C16/42;C23C16/44;C30B25/20;C30B29/36 |
主分类号 |
H01L21/205 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|