发明名称 METHOD FOR PRODUCING SiC EPITAXIAL WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method for producing an SiC epitaxial wafer, capable of producing high quality SiC epitaxial wafers with a high production efficiency.SOLUTION: A method for producing an SiC epitaxial wafer of the present invention includes the steps of: vacuum baking a coated carbon material member at a vacuum degree of 2.0×10Pa or less in a vacuum baking furnace for exclusive use; placing the coated carbon material member in an epitaxial wafer production apparatus; and disposing an SiC substrate in the epitaxial wafer production apparatus and epitaxially growing an SiC epitaxial film on the SiC substrate.
申请公布号 JP2015050436(A) 申请公布日期 2015.03.16
申请号 JP20130183373 申请日期 2013.09.04
申请人 SHOWA DENKO KK 发明人 ODAWARA MICHIYA;TAJIMA YUTAKA;MUTO DAISUKE;MOMOSE KENJI
分类号 H01L21/205;C23C16/42;C23C16/44;C30B25/20;C30B29/36 主分类号 H01L21/205
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