| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device with reduced adhesion of solder to a housing part, and a flexible circuit board.SOLUTION: A semiconductor device 10 includes a flexible circuit board 21 and a semiconductor device body 22. The semiconductor device body 22 includes a housing part 22a and lead terminals 23 extending from the housing part 22a. The housing part 22a includes recesses 22c on a surface on a mounting surface 27a side, and the lead terminals 23 extend from bottom surfaces of the recesses 22c. A flexible substrate body 27 has penetrating holes 27c and 27d. The penetrating holes 27c and 27d penetrate through the mounting surface 27a and a rear surface 27b, and form through holes TH1 and TH2. The lead terminals 23 are each inserted into the through holes TH1 and TH2. The lead terminals 23 are inserted so as to penetrate through a coverlay 25, and the coverlay 25 is in contact with the peripheries of the lead terminals 23.</p> |
