THERMOSETTING RESIN MOLDING MATERIAL AND ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin molding material capable of forming a cured product which has excellent heat resistance and flame retardancy and is excellent in electrical insulation at a high temperature and adhesion to a metal at a high temperature.SOLUTION: The thermosetting resin molding material contains: an epoxy resin containing a polyfunctional epoxy resin having two or more epoxy groups in one molecule; a cyanate resin containing a polyfunctional cyanate resin having two or more cyanate groups (-OCN) in one molecule; and at least one compound selected from the group consisting of an aromatic carboxylic acid and an aromatic carboxylic acid ester having a phenolic hydroxyl group.