CMP METHOD FOR METAL-CONTAINING SUBSTRATES

摘要

AN AQUEOUS CHEMICAL-MECHANICAL POLISHING COMPOSITION FOR POLISHING METAL CONTAINING SUBSTRATES COMPRISING AN ABRASIVE PARTICLE CONSISTING ESSENTIALLY OF A PRIMARY PARTICLE MODIFIED WITH AN ALUMINOSILICATE LAYER, AND WHEREIN THE ABRASIVE PARTICLE HAS A ZETA POTENTIAL MEASURED AT PH 2.3 OF ABOUT -5 MV TO ABOUT -100MV. THE COMPOSITION CAN BE USED TO POLISH THE SURFACE OF A TUNGSTEN CONTAINING SUBSTRATE.