| 摘要 |
<p>The present invention relates to a power module package and a method for manufacturing the same. The power module package according to the embodiment of the present invention includes an external connection terminal; a substrate which has a combination unit which is inserted into one end of the external connection terminal; and a semiconductor chip which is mounted on one surface of the substrate. According to one embodiment of the present invention, the substrate includes an insulating material; a circuit layer which is formed in one surface of the insulating material, and a metal layer which is formed on the other surface of the insulating material.</p> |
