发明名称 CYLINDRICAL SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME
摘要 PROVIDED IS A CYLINDRICAL CERAMIC SPUTTERING TARGET, WHICH SIGNIFICANTLY REDUCES THE OCCURRENCE OF A CRACK, A CHIP, EXTRAORDINARY DISCHARGE AND A NODULE. BY FILLING A MOLTEN BONDING MATERIAL IN A CAVITY DEFINED BY A CYLINDRICAL CERAMIC TARGET MATERIAL AND A CYLINDRICAL BASE MATERIAL, STARTING COOLING THE MOLTEN BONDING MATERIAL FROM ITS ONE END TOWARD ITS OTHER END IN A CYLINDRICAL AXIAL DIRECTION IN SEQUENCE, AND FURTHER FILLING THE MOLTEN BONDING MATERIAL IN THE CAVITY DURING COOLING, A CYLINDRICAL CERAMIC SPUTTERING TARGET IS MANUFACTURED SO AS TO BE CHARACTERIZED IN THAT AS OBSERVED BY AN X-RAY RADIOGRAPH OF THE BONDING MATERIAL, THE TOTAL AREA OF PORTIONS WHERE NO BONDING MATERIAL EXISTS IS 10 CM2 OR LESS PER 50 CM OF X-RAY RADIOGRAPH AREA, AND THE MAXIMUM AREA OF THE PORTIONS WHERE NO BONDING MATERIAL EXISTS IS 9 CM2 OR LESS.
申请公布号 MY153711(A) 申请公布日期 2015.03.13
申请号 MY2010PI05828 申请日期 2009.06.09
申请人 TOSOH CORPORATION 发明人 TOSOH CORPORATION;TODOKO, SHIGEHISA;TAMANO, KIMIAKI;ITOH, KENICHI;SHIBUTAMI, TETSUO
分类号 C23C14/34 主分类号 C23C14/34
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