| 摘要 |
<p>A method for manufacturing a combined heat dissipation device, the method comprising the following steps: preparing a circuit board (1) and a heat dissipation device (2); the circuit board (1) is provided with two heat generating chips (10, 12) thereon; the heat dissipation device (2) comprises a main body (3) and an adjusting assembly (5); the main body (3) comprises a base (30) and a plurality of heat dissipation fins (32); the base (30) has a fixed copper post (40) and is provided with a through-hole (36); the adjusting assembly (5) is installed in the through-hole (36), and is able to move up and down; firstly installing the main body (3) on the circuit board (1), so that the copper post (40) is attached to one heat generating chip (10); coating the adjusting assembly (5) with welding material, and then installing the adjusting assembly (5) into the through-hole (36); pressing the main body (3) and the adjusting assembly (5) by utilizing a pressure device, such that the main body (3) and the adjusting assembly (5) press tightly against the two heat generating chips (10, 12); and lastly heating together the combined heat dissipation device so as to weld the same into a single piece. The manufacturing method can flexibly accommodate the height differences of chips on different circuit boards, and enables a heat dissipation device to have good contact with both heat generating chips, thus realizing an ideal heat dissipation effect.</p> |
