FAST NANOIMPRINTING METHODS USING DEFORMABLE MOLD

摘要

Methods for nanoimprint lithography using a deformable mold. Generally, the method includes a deformable mold fixed firmly onto a hollow mold holder around its full periphery is attached to top inner surface of the chamber and positioned underneath the transparent section. The central area of the mold is freely accessible from underneath through the opening of the mold holder. At beginning of the imprinting, the substrate with a layer of resist is positioned underneath the mold at a predetermined gap between them and a substrate is moved up to contact with the mold either under vacuum or under atmosphere. After consolidating the resist, the substrate is separated from the mold by either direct pull-down enabled by stage movement or deforming the mold enabled by differential pressure between the mold mini-chamber and the bulk volume of the chamber, or mixing of both.

主权项

1. A method for imprinting a substrate having a moldable surface with a mold having a molding surface, wherein the periphery of said mold is attached on a mold fixture located inside a chamber and connected to said chamber, said mold fixture comprises a first interface seal to seal the attached periphery and a second interface seal to seal the interface between said fixture and said chamber, comprising the steps of:
disposing said substrate inside said chamber and adjacent said mold such that said moldable surface is adjacent said molding surface; adjusting the gap between said moldable surface and said molding surface; removing gas from the space between said moldable surface and said molding surface forming contact between said moldable surface and said molding surface; imprinting said molding surface against said moldable surface by pressing said mold and said substrate together with pressurized gas; deforming assembly of said mold and said substrate that are pressed together by said step of imprinting, said deforming is effected by implementing differential gas pressure between two sides of said assembly to have a least portion of the peripheral of said substrate released from said mold; and separating said moldable surface away said molding surface.