| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a packageless solid-state imaging device that can control and set an interval between an imaging region of a chip and a translucent member covering the imaging region to a desired value with ease.SOLUTION: A solid-state imaging device 1 comprises: a semiconductor chip 2 having an imaging region 2a; a translucent member 3 covering the imaging region 2a and installed at an interval d from the imaging region 2a; and a spacer 4 fixing the translucent member 3 to a fixed part. The spacer 4 has a plurality of spacer members 5a and 5b laminated between the translucent member 3 and the fixed part.</p> |
