发明名称 |
Cup-Like Getter Scheme |
摘要 |
The present disclosure relates to a method of gettering that provides for a high efficiency gettering process by increasing an area in which a getter layer is deposited, and an associated apparatus. In some embodiments, the method is performed by providing a substrate into a processing chamber having one or more residual gases. A cavity is formed within a top surface of the substrate. The cavity has a bottom surface and sidewalls extending from the bottom surface to the top surface. A getter layer, which absorbs the one or more residual gases, is deposited over the substrate at a position extending from the bottom surface of the cavity to a location on the sidewalls. By depositing the getter layer to extend to a location on the sidewalls of the cavity, the area of the substrate that is able to absorb the one or more residual gases is increased. |
申请公布号 |
US2015069539(A1) |
申请公布日期 |
2015.03.12 |
申请号 |
US201314023572 |
申请日期 |
2013.09.11 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Chan Chih-Jen;Tseng Lee-Chuan;Lin Shih-Wei;Chang Che-Ming;Chou Chung-Yen;Hsieh Yuan-Chih |
分类号 |
B81C1/00;B81B7/00;H01L21/322 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method of gettering, comprising:
providing a substrate into a processing chamber having one or more residual gases; forming a cavity within a top surface of the substrate, wherein the cavity comprises a bottom surface and sidewalls extending from the bottom surface to the top surface of the substrate; and depositing a getter layer, configured to absorb the one or more residual gases, over the substrate at a position extending from the bottom surface of the cavity to a location on the sidewalls. |
地址 |
Hsin-Chu TW |