发明名称 Cup-Like Getter Scheme
摘要 The present disclosure relates to a method of gettering that provides for a high efficiency gettering process by increasing an area in which a getter layer is deposited, and an associated apparatus. In some embodiments, the method is performed by providing a substrate into a processing chamber having one or more residual gases. A cavity is formed within a top surface of the substrate. The cavity has a bottom surface and sidewalls extending from the bottom surface to the top surface. A getter layer, which absorbs the one or more residual gases, is deposited over the substrate at a position extending from the bottom surface of the cavity to a location on the sidewalls. By depositing the getter layer to extend to a location on the sidewalls of the cavity, the area of the substrate that is able to absorb the one or more residual gases is increased.
申请公布号 US2015069539(A1) 申请公布日期 2015.03.12
申请号 US201314023572 申请日期 2013.09.11
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Chan Chih-Jen;Tseng Lee-Chuan;Lin Shih-Wei;Chang Che-Ming;Chou Chung-Yen;Hsieh Yuan-Chih
分类号 B81C1/00;B81B7/00;H01L21/322 主分类号 B81C1/00
代理机构 代理人
主权项 1. A method of gettering, comprising: providing a substrate into a processing chamber having one or more residual gases; forming a cavity within a top surface of the substrate, wherein the cavity comprises a bottom surface and sidewalls extending from the bottom surface to the top surface of the substrate; and depositing a getter layer, configured to absorb the one or more residual gases, over the substrate at a position extending from the bottom surface of the cavity to a location on the sidewalls.
地址 Hsin-Chu TW