发明名称 OPTICAL-SEMICONDUCTOR-ELEMENT SEALING COMPOSITION, OPTICAL-SEMICONDUCTOR-ELEMENT SEALING MOLDED ARTICLE, OPTICAL-SEMICONDUCTOR-ELEMENT SEALING SHEET, OPTICAL SEMICONDUCTOR DEVICE, AND SEALED OPTICAL SEMICONDUCTOR ELEMENT
摘要 <p>This optical-semiconductor-element sealing composition contains a sealing resin and optically diffusive organic particles. The absolute value of the difference between the index of refraction of the sealing resin and the index of refraction of the optically diffusive organic particles is 0.020-0.135, inclusive. The proportion of optically diffusive organic particles contained in the optical-semiconductor-element sealing composition in relation thereto is 1-10 mass%, inclusive. The optical-semiconductor-element sealing composition may be used in an optical semiconductor element.</p>
申请公布号 WO2015033890(A1) 申请公布日期 2015.03.12
申请号 WO2014JP72939 申请日期 2014.09.01
申请人 NITTO DENKO CORPORATION 发明人 CHANG, CHENG;MITANI, MUNEHISA;KATAYAMA, HIROYUKI;EBE, YUKI;FUJII, HIRONAKA;YAMADA, MASAJI
分类号 H01L33/52;C09K11/08;F21V9/08;F21V9/16;F21Y101/02;H01L33/50;H01L33/60 主分类号 H01L33/52
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