| 发明名称 |
APPARATUS AND METHOD FOR CLEANING |
| 摘要 |
A semiconductor structure includes a molding compound, a conductive plug, and a cover. The conductive plug is in the molding compound. The cover is over a top meeting joint between the conductive plug and the molding compound. The semiconductor structure further has a dielectric. The dielectric is on the cover and the molding compound. |
| 申请公布号 |
US2015068552(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201314023099 |
申请日期 |
2013.09.10 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
LIU PING-YIN;HUANG XIN-HUA;CHAO LAN-LIN |
| 分类号 |
H01L21/67 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for cleaning a plate designed for cleaning a wafer surface, comprising:
a container including an opening and a bottom surface, wherein the opening is configured to receive the plate and the bottom surface is under the plate during a predetermined mode; an exit in the container; and a sonicator coupled to the container, wherein the sonicator applies an ultrasonic wave on the plate during the predetermined mode. |
| 地址 |
Hsinchu TW |
