| 摘要 |
PROBLEM TO BE SOLVED: To remove a hard mask without giving damage to metal wiring.SOLUTION: A substrate processing method includes: a process liquid supply step; a chemical liquid supply step; and a removal liquid supply step. In the process liquid supply step, the process liquid containing a volatile component and used for forming a film on a substrate is supplied to the substrate in which a hard mask is formed on the surface and at least a part of metal wiring formed inside is exposed, and the exposed surface of the metal wiring is covered. In the chemical supply step, a predetermined chemical liquid for dissolving the hard mask is supplied to the substrate having the process liquid solidified or cured by volatilization of the volatile component. In the removal liquid supply step, the removal liquid for removing the process liquid is supplied to the process liquid solidified or cured after the chemical liquid supply step. |
