发明名称 |
CURABLE COMPOSITION AND CONNECTION STRUCTURE |
摘要 |
This invention provides a curable composition that uses a phenoxy resin that makes it possible to obtain a curable composition that, when cured, is highly adhesive in high-temperature, high-humidity environments. This curable composition contains conductive particles and a phenoxy resin that has a hydrolyzable group in a side chain. |
申请公布号 |
WO2015033834(A1) |
申请公布日期 |
2015.03.12 |
申请号 |
WO2014JP72422 |
申请日期 |
2014.08.27 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
ISHIZAWA, HIDEAKI;KUBOTA, TAKASHI |
分类号 |
C08L71/10;C08F290/06;C08F299/04;C08G59/17;C08L63/00;H01B1/00;H01B1/22 |
主分类号 |
C08L71/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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