CLUSTER EQUIPMENT FOR TREATING SUBSTRATE

摘要

The present invention relates to a cluster facility for treating a substrate. The cluster facility for treating a substrate according to an embodiment of the present invention comprises: a facility front end module which has multiple load ports to place cassettes to load a substrate and includes a first substrate convey robot to convey the substrate; multiple load lock chambers which are connected to the facility front end module through a gate valve and can selectively convert an internal pressure between an atmospheric pressure and a vacuum pressure; a transfer chamber which is connected to the load lock chambers through the gate valve and includes a second substrate convey robot to convey the substrate; multiple load lock chambers for a treatment module which are connected to the transfer chamber through the gate valve and have substrate loading units to load the substrates in an arrangement type; multiple process chambers which are arranged on the upper part of the load lock chambers for a treatment module to treat the substrates loaded on the substrate loading units; and a control unit to control an operation of the cluster facility to perform a process of treating the substrate, to proceed with a post-process for the process chambers after dummy substrates are withdrawn into vacuum pressure space from the process chambers if the treatment of the substrate is completed, and to control the withdrawn dummy substrates to be introduced into the process chambers if the post-process is completed, thereby preventing pollution of the chamber and another wafer due to dummy wafers.