RESIN MULTILAYER SUBSTRATE

摘要

Provided is a highly reliable resin multilayer substrate (a resin multilayer substrate comprising a plurality of thermoplastic substrate resin layers that are mainly composed of an LCP), which is not susceptible to defects such as separation between a substrate resin layer/a component and a sealing resin layer, cracks and solder splash even in cases where the resin multilayer substrate is exposed to a process that is accompanied by heating. The present invention is a resin multilayer substrate which is provided with: a multilayer substrate main body that comprises a plurality of substrate resin layers laminated on each other; a component which is mounted on at least one main surface of the multilayer substrate main body; and a sealing resin layer that seals the main surface of the multilayer substrate main body and the component. The substrate resin layers are thermoplastic resin layers that are mainly composed of a liquid crystal polymer. The resin of the sealing resin layer is mainly composed of a silicone resin, and the sealing resin layer has a water vapor transmission rate of 1-52 g/m2·24 hr.