| 发明名称 |
HIGH CURRENT INTERCONNECT SYSTEM AND METHOD FOR USE IN A BATTERY MODULE |
| 摘要 |
A printed circuit board (PCB) assembly may include a PCB and a high current interconnect mounted on the PCB. The high current interconnect may be configured to electrically couple a first high current bladed component, a second high current bladed component, and a trace disposed on the PCB. The high current interconnect may include feet made of a conductive material that are coupled to the PCB. The trace may be coupled to the feet via a weld. |
| 申请公布号 |
US2015072196(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201414230737 |
申请日期 |
2014.03.31 |
| 申请人 |
Johnson Controls Technology Company |
发明人 |
Soleski Edward J.;DeKeuster Richard M.;Thieme Brian L.;Dulle Ronald J.;Balk Mikhail S. |
| 分类号 |
H05K3/32;H01M10/42;H01M10/04;H05K1/18 |
主分类号 |
H05K3/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board (PCB) assembly comprising:
a PCB; and a high current interconnect mounted on the PCB and configured to electrically couple a first high current bladed component, a second high current bladed component, and a trace disposed on the PCB, wherein the high current interconnect comprises feet coupled to the PCB, the feet comprise a conductive material, and the trace is electrically coupled to the feet. |
| 地址 |
Holland MI US |
