THROUGH VIA PACKAGE

摘要

An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.

主权项

1. A device, comprising:
an integrated circuit die having an active side and an inactive side; electrical contacts on an active side of the integrated circuit die; first conductive redistribution lines overlying the active side of the die and coupled to the respective electrical contacts; second conductive redistribution lines overlying the inactive side of the die; a plurality of through vias, each through via electrically coupling a respective first conductive redistribution line to a respective second redistribution line; first solder balls coupled to the first conductive redistribution lines; and a first encapsulation layer on the first metal redistribution lines and encapsulating sides surfaces of the first solder balls, the first encapsulation layer and the first solder balls having a planar surface.