| 摘要 |
A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space,;The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides. |
