| 摘要 |
A novel siloxane compound (A) containing a reactive functional group is provided which is a block siloxane oligomer having one or more chain silicone segments and one or more segments formed by the hydrolysis and condensation of a tri(C1-10 alkoxy)silane having a group selected from a group consisting of epoxy-containing reactive functional groups, methyl, and ethyl, at least some of the segments formed by hydrolysis and condensation being a segment containing a reactive functional group having at least one epoxy group. Also provided are: a curable resin composition comprising the siloxane compound (A) and a hardener (B); and a photosemiconductor element (e.g., LED) encapsulated with a cured object obtained from the composition. The encapsulated photosemiconductor element has excellent light resistance and a sufficiently low low-temperature elastic modulus. The siloxane compound can be obtained by: a first-stage reaction in which a silanol-terminated silicone oil (b) is reacted with an alkoxysilane compound in such a proportion that the amount of the alkoxy groups of the alkoxysilane compound is in the range of 1.5-200 equivalents per equivalent of the silanol groups of the silicone oil (b); and a subsequent second-stage reaction in which the alkoxy groups of the alkoxysilane compound and of the product of the first-stage reaction are hydrolyzed and condensed in the presence of water. |
