| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezo-electric device formed by bonding a silicon substrate and a piezoelectric body and a method of fabricating the piezo-electric device. <P>SOLUTION: A method includes heating a surface of a silicon substrate 1, forming a thermal oxide film 1d on a surface of a supporting layer 1a on an opposite side from an insulating oxide film layer 1b, and forming a thermal oxide film 1e on a surface of an active layer 1c on an opposite side from the insulating oxide film layer 1b. An adhesion layer 4 for tightly adhering a bonding layer is formed on a SOI substrate 1. A chip-shaped piezoelectric body 2 in which electrode layers 2b1 and 2b2 are sequentially formed on each side of a piezoelectric material 2a formed from PZT is disposed on the adhesion layer 4 through a soldering material 3a<SB POS="POST">1</SB>as a metal paste. Then, the bonding layer is formed by baking the soldering material 3a<SB POS="POST">1</SB>to be hardened, and the SOI substrate 1 and the piezoelectric body 2 are bonded by the bonding layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
