| 摘要 |
<p>An embodiment of the present invention provides a light emitting device package comprising: a package body; a light emitting structure which is arranged on the package body, includes a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, wherein the light emitting structure is divided into at least two light emitting cells; a support substrate which is interleaved between the package body and the light emitting structure; a first electrode and a second electrode which are connected to each of the light emitting cells; and a fluorescent body which is arranged on each of the light emitting cells, wherein in adjacent light emitting cells, at least two of the first conduction type semiconductor layer, the active layer, and the second conduction type semiconductor layer are electrically separated from one another. According to the invention, a degree of freedom of an arrangement of a light source is increased and a manufacturing cost is decreased.</p> |
