| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a novel structure of an imaging device suitable for improving imaging performance. <P>SOLUTION: An imaging device includes a first chip and a second chip. In the first chip, light-receiving pixels and through wiring are formed. The plurality of light-receiving pixels are arranged on a light-receiving surface and generate an electrical signal according to incident light. The through wiring transmits the electrical signal of the light-receiving pixels to the opposite surface of the light-receiving surface. On the other hand, in the second chip, read circuits are formed. Each of the read circuit reads out the electrical signal via the through wiring and outputs the signal as an image signal. In the imaging device, the opposite surface of the first chip and the read circuits of the second chip are disposed in the opposite direction, and the through wiring and terminals of the read circuits are electrically bonded. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
