发明名称 METHOD FOR MANUFACTURING SUBSTRATE PRODUCT
摘要 <p>According to the present invention, provided is a method for manufacturing a substrate product which includes the steps of: providing a substrate with a first bump which has a preset color on the upper side thereof; providing a die which is arranged on the upper side of the substrate and has a light transmission property; providing a laser radiation unit which is arranged on the upper side of the die and radiates a laser of a specific wavelength which reacts to the color of the first bump; and bonding the substrate to the die by reflowing the first bump by radiating the laser from the laser radiation unit.</p>
申请公布号 KR20150026631(A) 申请公布日期 2015.03.11
申请号 KR20130105722 申请日期 2013.09.03
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, SEOCK HYUN;HEO, KWANG MIN;CHO, DONG KYU;JUNG, GYUNG MIN
分类号 H05K3/32 主分类号 H05K3/32
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