<p>According to the present invention, provided is a method for manufacturing a substrate product which includes the steps of: providing a substrate with a first bump which has a preset color on the upper side thereof; providing a die which is arranged on the upper side of the substrate and has a light transmission property; providing a laser radiation unit which is arranged on the upper side of the die and radiates a laser of a specific wavelength which reacts to the color of the first bump; and bonding the substrate to the die by reflowing the first bump by radiating the laser from the laser radiation unit.</p>
申请公布号
KR20150026631(A)
申请公布日期
2015.03.11
申请号
KR20130105722
申请日期
2013.09.03
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
PARK, SEOCK HYUN;HEO, KWANG MIN;CHO, DONG KYU;JUNG, GYUNG MIN