Apparatuses, systems and methods for treating substrate

摘要

Provided is an apparatus, system and method for treating a substrate, and more particularly, a substrate treating apparatus having a cluster structure, a substrate treating system, and a substrate treating method using the substrate treating system. The substrate treating apparatus includes a load port on which a container containing a substrate is installed, a plurality of process modules treating the substrate, a transfer module disposed between the load port and the process modules, and transferring the substrate between the container and the process modules, and a buffer chamber disposed between neighboring ones of the process modules, and providing a space for carrying the substrate between the neighboring process modules.

主权项

1. A substrate treating apparatus comprising:
a load port on which a container containing a substrate is installed; a plurality of process modules configured to treat the substrate; a transfer module disposed between the load port and the process modules, and configured to transfer the substrate between the container and the process modules; and a buffer chamber disposed between neighboring ones of the process modules, and configured to provide a space for carrying the substrate between the neighboring process modules, wherein the buffer chamber comprises:
a lower housing;a lower support member disposed in the lower housing, and supporting the substrate;a rotation member configured to rotate the substrate placed on the lower support member;an upper housing vertically stacked on the lower housing;an upper support member disposed in the upper housing, and supporting the substrate;a heating member configured to heat the substrate placed on the upper support member; anda plasma supplier configured to supply plasma to the upper housing for performing a plasma process.