Electronic device, wiring substrate, and method for manufacturing electronic device

摘要

Even in an electronic device where electrodes are coupled electrically using a solder, sections to which electrodes of an electronic component are coupled are switched by a method other than changing circuits of the electronic component or changing circuits of a wiring substrate.;The electronic device includes: a wiring substrate having two or more first electrodes over one surface thereof; and an electronic component having, over one surface thereof, two or more second electrodes arranged corresponding to the two or more first electrodes, respectively. At least one of the first electrodes is a specific electrode divided into two or more divided portions, and the divided portions are coupled to different wirings, respectively. Further, at least one of the divided portions is coupled to a corresponding second electrode through a solder.

主权项

1. An electronic device comprising:
a wiring substrate having two or more first electrodes over one surface thereof; an electronic component having, over one surface thereof, two or more second electrodes arranged corresponding to said two or more first electrodes, respectively, wherein at least one of said first electrodes is a specific electrode divided into two or more divided portions, the two or more divided portions being separated by a gap configured to keep a solder from coming in contact with at least one of the divided portions; wherein said divided portions are coupled to different wirings, respectively, and wherein at least one of said divided portions is coupled to corresponding said second electrode through the solder.