Method of manufacturing light-emitting device with fluorescent layer

摘要

A method of manufacturing a light-emitting device includes disposing a light-emitting element on a supporting member, dispersing a fluorescent substance having a particle diameter of 20 to 45 μm in a material of the light-transmitting member at a concentration of 40 to 60 wt %, dripping raw material for the fluorescent layer on the light-emitting element while lowering the viscosity of the raw material, and thermally curing the coated layer.

主权项

1. A method of manufacturing a light-emitting device comprising:
disposing an LED chip on a supporting member; dispersing a fluorescent substance having a particle diameter ranging from 20 to 45 μM in a material of a light-transmitting member at a concentration of 40 to 60 wt % to obtain a raw material for a fluorescent layer; dripping the raw material for the fluorescent layer on the LED chip while lowering the viscosity of the raw material, thereby forming a coated layer; and thermally curing the coated layer to form the fluorescent layer having a thickness ranging from 80 to 240 μm, wherein a surface of the fluorescent layer is in contact with an external atmosphere and has recesses and projections that correspond to an arrangement of the particles of the fluorescent substance.