Manufacturing method of semiconductor device

摘要

A manufacturing yield of a semiconductor device including a power transistor is improved. When forming a tip portion LE1c of a first lead, a tip portion LE2c of a second lead, and a tip portion LE3c of a third lead by using a spanking die SDM1, the tip portion LE1c of the first lead, the tip portion LE2c of the second lead, and the tip portion LE3c of the third lead are pressed by an upper surface of a protrusion portion provided on a pressing surface of a lower die SD1 and a bottom surface of a groove portion provided in a pressing surface of an upper die SU1, and a bent portion of the second lead and a bent portion of the third lead are pressed by a flat pressing surface of the lower die SD1 and a flat pressing surface of the upper die SU1.

主权项

1. A manufacturing method of a semiconductor device, comprising the steps of:
(a) providing a semiconductor chip including a front surface and a back surface opposite to the front surface; (b) providing a lead frame including a first surface and a second surface opposite to the first surface, and having a chip mounting portion, a first lead connected to the chip mounting portion, a second lead arranged spaced apart from the first lead and a holding portion connecting the first lead with the second lead, the second lead being arranged adjacent to the chip mounting portion and the first lead in a plan view; (c) mounting the semiconductor chip over the chip mounting portion such that the back surface of the semiconductor chip faces the first surface of the chip mounting portion; (d) electrically coupling a first electrode pad formed on the surface of the semiconductor chip and the second lead via a bonding wire; (e) forming a resin sealing body, by sealing the semiconductor chip, the chip mounting portion, a part of the first lead, and a part of the second lead with resin; (f) separating the first lead and the second lead from each other by removing the holding portion, wherein a part of the second lead which is exposed from the resin sealing body has a first part including a tip portion of the second lead, a second part close to the resin sealing body, and a third part between the first part and the second part, (g) after the step (f), deforming the second lead such that a distance between the first part of the second lead and the first lead is greater than a distance between the second part of the second lead and the first lead in plan view; and (h) after the step (g), pressing the third part of the second lead with a die.