发明名称 |
Electronic deviceswith support frames and mechanically-bonded plastic and methods for forming such electronic devices |
摘要 |
Electronic devices with support frames and mechanically-bonded plastic and methods for forming such electronic devices are provided. A representative electronic device includes: a housing that incorporates: a metal chassis having a base and a sidewall extending outwardly therefrom to define an interior, the chassis having an opening extending there through; a plastic part mechanically bonded to the metal of the chassis, the plastic part spanning the opening; and a support frame mounted at least partially within the housing such that the support frame increases rigidity of the housing. |
申请公布号 |
US8975540(B2) |
申请公布日期 |
2015.03.10 |
申请号 |
US201113329460 |
申请日期 |
2011.12.19 |
申请人 |
HTC Corporation |
发明人 |
Mareno Jason Donald;Reier Bart Peter |
分类号 |
H01R13/502 |
主分类号 |
H01R13/502 |
代理机构 |
McClure, Qualey & Rodack, LLP |
代理人 |
McClure, Qualey & Rodack, LLP |
主权项 |
1. An electronic device comprising:
a housing comprising:
a metal chassis having a base and a sidewall extending outwardly therefrom to define an interior, the metal chassis having an opening extending through the metal chassis, the metal chassis having first recesses positioned about the opening on the base and second recesses positioned about the opening on the sidewall; anda plastic part mechanically bonded to the first recesses on the base of the metal chassis and the second recesses on the sidewall of the metal chassis such that a torque box is formed to stiffen the metal chassis, the plastic part spanning and filling the opening; and a support frame mounted at least partially within the housing such that the support frame increases rigidity of the housing by the support frame spanning a width and length of the plastic part. |
地址 |
Taoyuan, Taoyuan County TW |