发明名称 |
Printed wiring board, method of soldering quad flat package IC, and air conditioner |
摘要 |
A printed wiring board has a solder-land group for placing a quad flat package IC, and the solder-land group consists of front solder-land groups and rear solder-land groups. The printed wiring board includes rear solder-drawing lands that are positioned adjacent to rear solder-land groups, that have front edges each of which is substantially parallel to a longitudinal direction of rear solder lands constituting the rear solder-land group and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective two separate lands is made wider in its rearward portion than that in its frontward portion, and that have a slit substantially parallel to the longitudinal direction near the front edge. |
申请公布号 |
US8975533(B2) |
申请公布日期 |
2015.03.10 |
申请号 |
US201113272663 |
申请日期 |
2011.10.13 |
申请人 |
Mitsubishi Electric Corporation |
发明人 |
Miura Tsuyoshi;Namikoshi Kazuo |
分类号 |
H05K1/09;H05K1/16;B23K31/00;H05K3/34;B23K1/00;B23K1/08;B23K1/20;H05K1/11 |
主分类号 |
H05K1/09 |
代理机构 |
Buchanan Ingersoll & Rooney PC |
代理人 |
Buchanan Ingersoll & Rooney PC |
主权项 |
1. A printed wiring board that has a solder land group used for placing a quad flat package integrated circuit (IC), the solder land group including front solder-land groups and rear solder-land groups, comprising:
rear solder-drawing lands that are positioned adjacent to the rear solder-land groups, that have front edges each of which is substantially parallel to a longitudinal direction of solder lands constituting the rear solder-land group and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are completely separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective separate rear solder-drawing lands is made wider in a rearward portion between the rear solder-drawing lands than in a frontward portion between the rear solder-drawing lands that is positioned forward in the traveling direction, and that have a slit substantially parallel to the longitudinal direction near the front edge, wherein the gap between the two separate rear solder-drawing lands from a front end to a predetermined point has a first constant width, and the gap between the two separate rear solder-drawing lands in a rearward portion relative to the predetermined point has a second constant width wider than the first constant width. |
地址 |
Chiyoda-Ku, Tokyo JP |