发明名称 |
Semiconductor package having interposer with openings containing conductive layer |
摘要 |
A semiconductor package includes a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first surface; a second structural body placed over the first structural body, and formed with second connection members on a surface thereof which faces the first surface of the first structural body; and an interposer interposed between the first structural body and the second structural body, and having a body which is formed with openings into which the first connection members and the second connection members are inserted and a conductive layer which is formed to fill the openings. |
申请公布号 |
US8975758(B2) |
申请公布日期 |
2015.03.10 |
申请号 |
US201113337197 |
申请日期 |
2011.12.26 |
申请人 |
SK Hynix Inc. |
发明人 |
Lee Seung Hyun |
分类号 |
H01L23/48;H01L23/52;H01L29/40;H01L23/02;H01L23/34;H01L23/498;H01L23/31 |
主分类号 |
H01L23/48 |
代理机构 |
William Park & Associates Patent Ltd. |
代理人 |
William Park & Associates Patent Ltd. |
主权项 |
1. A semiconductor package comprising:
a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first surface; a second structural body placed over the first structural body, and formed with second connection members on a surface which faces the first surface of the first structural body; an interposer interposed between the first structural body and the second structural body, and having a body which is formed with a plurality of openings into which one of the first connection members is inserted into a single opening and one of the second connection members is inserted into the single opening among the plurality of openings and a conductive layer which is formed to fill the plurality of openings; an encapsulation member formed to seal the first surface of the first structural body; and external connection terminals formed on the second surface of the first structural body. |
地址 |
Gyeonggi-do KR |