发明名称 |
IMPRINTED BI-LAYER MICRO-STRUCTURE |
摘要 |
An imprinted micro-structure includes a substrate having an edge area and a central area separate from the edge area. A cured bottom-layer, connecting layer, and top layer are formed over the substrate, each with a corresponding imprinted micro-channel having a cured micro-wire. The bottom micro-wire is in the central area and the edge area. The connecting-layer micro-wire contacts at least a portion of the bottom-layer micro-wire in the edge area. A cured edge micro-wire in the top layer contacts at least a portion of the connecting-layer micro-wire in the edge area. A top-layer micro-wire is located in a top-layer micro-channel and is separate from the edge micro-wire and bottom micro-wire. The bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire. |
申请公布号 |
US2015060112(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
US201314012269 |
申请日期 |
2013.08.28 |
申请人 |
COK RONALD STEVEN |
发明人 |
COK RONALD STEVEN |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
1. An imprinted micro-wire structure, comprising:
a substrate having an edge area and a central area separate from the edge area; a cured bottom layer formed in relation to the substrate; an imprinted bottom-layer micro-channel in the cured bottom layer in at least a portion of the central area and in at least a portion of the edge area, the bottom-layer micro-channel extending from the central area into the edge area; a cured bottom-layer micro-wire located in the bottom-layer micro-channel, the bottom-layer micro-wire extending from the central area into the edge area; a cured connecting layer adjacent to and in contact with the cured bottom layer and the bottom-layer micro-wire; an imprinted connecting-layer micro-channel in the cured connecting layer over at least a portion of the bottom-layer micro-channel in at least a portion of the edge area; a cured connecting-layer micro-wire located in the connecting-layer micro-channel contacting at least a portion of the bottom-layer micro-wire; a cured top layer adjacent to and in contact with the cured connecting layer and the connecting-layer micro-wire; an imprinted edge micro-channel in the cured top layer in at least a portion of the edge area and an imprinted top-layer micro-channel in the cured top layer separate from the bottom-layer micro-channel and over at least a portion of the bottom-layer micro-channel in at least a portion of the central area; an edge micro-wire located in the edge micro-channel contacting at least a portion of the connecting-layer micro-wire and a top-layer micro-wire located in the top-layer micro-channel that is electrically isolated from the edge micro-wire, the connecting-layer micro-wire, and the bottom-layer micro-wire; and wherein the bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire. |
地址 |
Rochester NY US |