发明名称 IMPRINTED BI-LAYER MICRO-STRUCTURE
摘要 An imprinted micro-structure includes a substrate having an edge area and a central area separate from the edge area. A cured bottom-layer, connecting layer, and top layer are formed over the substrate, each with a corresponding imprinted micro-channel having a cured micro-wire. The bottom micro-wire is in the central area and the edge area. The connecting-layer micro-wire contacts at least a portion of the bottom-layer micro-wire in the edge area. A cured edge micro-wire in the top layer contacts at least a portion of the connecting-layer micro-wire in the edge area. A top-layer micro-wire is located in a top-layer micro-channel and is separate from the edge micro-wire and bottom micro-wire. The bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.
申请公布号 US2015060112(A1) 申请公布日期 2015.03.05
申请号 US201314012269 申请日期 2013.08.28
申请人 COK RONALD STEVEN 发明人 COK RONALD STEVEN
分类号 H05K1/11 主分类号 H05K1/11
代理机构 代理人
主权项 1. An imprinted micro-wire structure, comprising: a substrate having an edge area and a central area separate from the edge area; a cured bottom layer formed in relation to the substrate; an imprinted bottom-layer micro-channel in the cured bottom layer in at least a portion of the central area and in at least a portion of the edge area, the bottom-layer micro-channel extending from the central area into the edge area; a cured bottom-layer micro-wire located in the bottom-layer micro-channel, the bottom-layer micro-wire extending from the central area into the edge area; a cured connecting layer adjacent to and in contact with the cured bottom layer and the bottom-layer micro-wire; an imprinted connecting-layer micro-channel in the cured connecting layer over at least a portion of the bottom-layer micro-channel in at least a portion of the edge area; a cured connecting-layer micro-wire located in the connecting-layer micro-channel contacting at least a portion of the bottom-layer micro-wire; a cured top layer adjacent to and in contact with the cured connecting layer and the connecting-layer micro-wire; an imprinted edge micro-channel in the cured top layer in at least a portion of the edge area and an imprinted top-layer micro-channel in the cured top layer separate from the bottom-layer micro-channel and over at least a portion of the bottom-layer micro-channel in at least a portion of the central area; an edge micro-wire located in the edge micro-channel contacting at least a portion of the connecting-layer micro-wire and a top-layer micro-wire located in the top-layer micro-channel that is electrically isolated from the edge micro-wire, the connecting-layer micro-wire, and the bottom-layer micro-wire; and wherein the bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.
地址 Rochester NY US