| 摘要 |
The invention relates to a method for producing a multi-layer element having a substrate and having at least one conductor structure connected to the substrate in a planar manner, which conductor structure has first regions made of electrically conductive material, which electrically conductive material is present in accordance with a specified pattern, electrically non-conductive second regions lying between the first regions. The method according to the invention is characterized by the following steps: connecting a conductor film (142) to the substrate (200) by means of a laterally structured adhesive layer (220) lying therebetween, in such a way that, in the first regions (240), a partial adhesive contact between the substrate and the conductor film is produced in a plurality of adhesion zones (224) and, in laterally extended second regions (250), the conductor film is not connected to the substrate by the adhesive or is connected to the substrate less strongly by the adhesive; structuring the conductor film by cutting the conductor film along boundaries of the first regions; and removing contiguous film pieces (142') of the conductor film from laterally extended second regions (250). The method is provided in particular for producing RFID antennas or flexible circuit boards in a roll-to-roll method. |
