PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board and a method for manufacturing the printed circuit board in which reliability of a thin solder resist area is improved by differentiating properties of the thin solder resist area and a thick solder resist area in a multilayer solder resist structure.SOLUTION: The printed circuit board comprises: a substrate 701 forming as a base of the printed circuit board; a circuit pattern 702 formed into a predetermined pattern on the substrate 701; a first solder resist 703a formed in a first specific area on the substrate 701 where the circuit pattern 702 is formed; and a second solder resist 703b which is formed in a second specific area on the substrate 701 where the circuit pattern 702 is formed, and which is stepped from the first solder resist 703a and has different properties from those of the first solder resist 703a.