| 摘要 |
<p>The invention relates to thermoplastic molding compounds containing A) 10 to 97 wt.% of a thermoplastic polyamide, B) 0.1 to 60 wt.% of red phosphorous, C) 1 to 25 wt.% of a polyacrylnitrile homopolymer, D) 0 to 40 wt.% of an impact modifier, E) 0 to 40 wt.% of magnesium hydroxide, and F) 0 to 60 wt.% of other additives, wherein the sum of the weight percentages A) to F) equals 100%.</p> |
