发明名称 PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a processing apparatus capable of surely forming a desired processing groove.SOLUTION: The processing apparatus for forming a groove by removing a part of a thin film layer formed on a substrate surface includes: a patterning tool having a cutting edge on a tip; a patterning head including a first portion having a longitudinal direction in a vertical direction and capable of holding the patterning tool on a lower end part of the first portion while holding a state where the cutting edge is directed vertically downward; and static pressure guide means including a guide part surrounding a part of the first portion of the patterning head in a horizontal plane and capable of guiding the patterning head in a vertical direction along the guide part while holding the patterning head in a non-contact state with the guide part by ejecting air respectively from a plurality of ejection holes formed on the surface of the first portion of the patterning head to an opposite face of the guide part.
申请公布号 JP2015043381(A) 申请公布日期 2015.03.05
申请号 JP20130174808 申请日期 2013.08.26
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 HORII RYOGO
分类号 H01L21/304;B23D1/10;H01L31/06 主分类号 H01L21/304
代理机构 代理人
主权项
地址