METHOD FOR PRODUCING SEALED SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

This method for producing a sealed semiconductor element comprises: a preparation step wherein a supporting sheet on which a semiconductor element is disposed is prepared; a sealing step wherein, at room temperature, the semiconductor element is embedded in and sealed by a sealing layer of a sealing sheet which is provided with a release layer, the sealing layer before complete curing, said sealing layer being laminated on the lower surface of the release layer and being formed of a thermosetting resin, and a reinforcing layer that is laminated on the upper surface of the release layer in order to reinforce the release layer and the sealing layer; a heating step wherein the sealing layer is heated and cured after the sealing step; and a release step wherein the reinforcing layer is separated after the heating step.