发明名称 METAL MATERIAL FOR ELECTRONIC COMPONENT, CONNECTOR TERMINAL USING THE SAME, CONNECTOR, AND ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a metal material for an electronic component which has low whisker properties and high durability.SOLUTION: The metal material for an electronic component includes: a substrate; an upper layer formed on the substrate and composed of an alloy of one or two elements selected from a constituent element group A consisting of Sn and In and one or more elements selected from a constituent element group B consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir; and an outermost layer formed on the upper layer and composed of one or two elements selected from a constituent element group C consisting of Au and Pt. The thickness of the upper layer is 0.02 to 3.00μm inclusive, and the line length of the outermost layer is≥50% of that of the upper layer.</p>
申请公布号 JP2015042772(A) 申请公布日期 2015.03.05
申请号 JP20130174915 申请日期 2013.08.26
申请人 JX NIPPON MINING & METALS CORP 发明人 SHIBUYA YOSHITAKA
分类号 C25D5/10;C25D7/00;H01B5/02;H01B7/00;H01B7/08 主分类号 C25D5/10
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