发明名称 METAL MATERIAL FOR ELECTRONIC COMPONENT, CONNECTOR TERMINAL USING THE SAME, CONNECTOR, AND ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a metal material for an electronic component which has low whisker properties and high durability.SOLUTION: The metal material for an electronic component includes: a substrate; an upper layer formed on the substrate and composed of an alloy of one or two elements selected from a constituent element group A consisting of Sn and In and one or more elements selected from a constituent element group B consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir; and an outermost layer formed on the upper layer and composed of one or two elements selected from a constituent element group C consisting of Au and Pt. The thickness of the upper layer is 0.02 to 3.00μm inclusive, and the thickness of the outermost layer is 0.0005μm or more and less than 0.02μm.</p>
申请公布号 JP2015042771(A) 申请公布日期 2015.03.05
申请号 JP20130174858 申请日期 2013.08.26
申请人 JX NIPPON MINING & METALS CORP 发明人 SHIBUYA YOSHITAKA
分类号 C25D7/00;C25D5/10;C25D5/50;H01B5/02;H01R12/59;H01R12/71;H01R13/03 主分类号 C25D7/00
代理机构 代理人
主权项
地址