发明名称 |
Semiconductor Package with Multi-Level Die Block |
摘要 |
A semiconductor package includes a block having a first side, a second side opposite the first side and a recessed region extending from the second side toward the first side so that the block has a thinner part in the recessed region and a thicker part outside the recessed region. The semiconductor package further includes a first semiconductor die and a second semiconductor die each having opposing first and second sides. The first semiconductor die is disposed in the recessed region of the block and attached to the thinner part of the block at the first side of the first semiconductor die. The second semiconductor die is attached to the second side of the first semiconductor die at a first side of the second semiconductor die. |
申请公布号 |
US2015061096(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
US201314013112 |
申请日期 |
2013.08.29 |
申请人 |
Infineon Technologies AG |
发明人 |
Goh Kok Chai |
分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
|
主权项 |
1. A semiconductor package, comprising:
a block having a first side, a second side opposite the first side and a recessed region extending from the second side toward the first side so that the block has a thinner part in the recessed region and a thicker part outside the recessed region; a first semiconductor die having opposing first and second sides, the first semiconductor die disposed in the recessed region of the block and attached to the thinner part of the block at the first side of the first semiconductor die; and a second semiconductor die attached to the second side of the first semiconductor die at a first side of the second semiconductor die. |
地址 |
Neubiberg DE |