发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed. |
申请公布号 |
US2015062846(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
US201314383365 |
申请日期 |
2013.02.25 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
Kim Ji Su;Chun Ki Do;Lee Kyu Won;Lee Sang Myung |
分类号 |
H05K3/46;H05K3/10;H05K1/11;H05K1/18;H05K1/03 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
1. A printed circuit board, comprising:
a core substrate including an internal circuit pattern on an upper surface and a lower surface; electronic devices which are mounted to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. |
地址 |
Jung-gu, Seoul KR |